For the thousands of chips used in cars, there is a simple fact that they can't fail. Reliability is critical to automotive semiconductor components, and any chip that fails during travel can result in expensive repairs and can even cause personal injury or death. In order to meet this special requirement of the automotive industry, semiconductor manufacturers must address and improve the reliability of the chip.
Although the basic functions of the car have not changed - it is still transporting people and things from one place to another - car technology and functionality have evolved and increased over time. Automakers are constantly adding new features to make our cars more efficient and safer, and to provide more entertainment - these features require the use of semiconductor components. Today, electronic components account for 35% of total vehicle manufacturing costs, and this proportion is expected to increase to 50% by 2030. Today, a car may need thousands of chips to support its technical functions (electronic fuel injection, gas and electric hybrids, etc.), safety functions (anti-lock brakes, airbags, etc.), and convenience features (satellite navigation, with smartphones) Combine, etc.). Moreover, as the advancement of driverless technology in terms of feasibility and popularity, the number of chips required for sensors and AI (artificial intelligence) required for unmanned vehicles will increase rapidly.
For the thousands of chips used in cars, there is a simple fact that they can't fail. Reliability is critical to automotive semiconductor components, and any chip that fails during travel can result in expensive repairs and can even cause personal injury or death. In order to meet this special requirement of the automotive industry, semiconductor manufacturers must address and improve the reliability of the chip.
Fortunately, for semiconductor manufacturers, they are very clear about the reliability of the chip: what is the defect! In fact, for well-designed semiconductor manufacturing processes and products, random defects are the main source of early chip reliability issues.
For semiconductor manufacturers, there are two chip defects that are most important:
(1) Fatal defects: These defects can cause the chip to fail during the final test phase of the semiconductor manufacturing process. Chips with fatal flaws will never leave the manufacturing plant. Fatal defects therefore affect the yield of semiconductor manufacturers.
(2) Potential defects: These defects can cause the chip to fail after aging or use for a period of time. Today, most chips with potential defects will pass the final test and will continue to move forward in the supply chain, including installation in cars. However, the ultimate potential defect can lead to chip failure - and the reliability of the chip will affect the reliability of the car.
Interestingly, there is a correlation between fatal defects (affecting yield) and potential defects (affecting reliability). The type of defect that affects the yield also affects reliability; the difference between the two is mainly in the size of the defect and the location of the chip pattern structure. For example, bridging defects (ie, excess material causing two unconnected lines to be connected and shorted) is a fatal flaw that can affect yield. Partial bridging defects - excess material between the two lines have not yet caused the connection - are potential defects and can cause reliability problems. With the environment and use, defects can become a complete bridge, eventually leading to short circuits and consequent chip failures.
This correlation between yield defects and reliability defects is not just the same type of defect: they are all caused by the same root cause in the semiconductor manufacturing process. Failure analysis has shown that most of the reliability defects are due to the chip factory and are related to the production process (and lead to yield issues). Since yield defects and reliability defects have the same root cause, increasing the yield of semiconductor chips will help improve reliability! In fact, in order to improve the reliability of automotive chips, semiconductor manufacturers have adopted a simple but critical strategy: to reduce the overall random defect level of the chip factory, which is the best way to reduce the possibility of generating reliability defects. Moreover, what is the best way to reduce overall random defects? It is a world-class defect reduction strategy.
This Accessories Including agming controller For Xbox one , PS4 , PS3, Xbox 360, Niintendo Switch,Nintendo Switch Pro, WII U ETC,controller both have wired and wireless, Also have Nintendo Switch Replacement Joy-Cons,Many choicese. We also can customize for you, custimize your loog, package,carton etc.
Our these kinds controllers bring you great experience, wireless controller all have Turbo, Dual Vibration, Gyro Sensor function,, Nintendo Switch Joy-Cons Replcement to your original one, Function all same as original.
All controllers high quality with compatitive price, we test one by one with gaming console before shipping. here you can see our more detailes pictures.
Game Controllers,Ps3 Controller,Xbox 360 Controller,Wireless Gamepad
Shenzhen GEME electronics Co,.Ltd , https://www.gemesz.com