1. When the data has a large area of ​​copper foil covering, the distance between the line or PAD and the copper skin is not within the production requirements, and the external size is large, (such as the wide) can be used to quickly trim the line or PAD and copper. The spacing of the skin. First copy all PADs of the circuit layer (this layer is the first layer) to an empty layer, delete the PAD corresponding to the large copper, and then enlarge the remaining PAD as the reduced circuit layer (ie, the second layer), and then The first layer is copied to an empty layer, and the large copper sheet is deleted as a third. The layering method is: first layer (addition layer), second layer (subtraction layer), third layer (addition layer). In general, in order to reduce the amount of data, we can only keep the first layer of large copper. If the distance between the solder and the large copper is not enough, the anti-welding after the enlargement (to meet the process capability) can be copied to an empty layer, and the remaining solder resist is amplified after the anti-welding corresponding to the large copper is removed. Second floor.
Note: After using this method to make the line, be sure to use the command to convert a composite layer of multiple layers of UTIliTIes-->Convert Composite into a layer, then carefully use this layer and the original with the Analysis-->Compare Layers command. Check.
Second, some texts have a lot of text boxes in the text layer, and the text box to line PAD spacing does not meet the process capability, you can learn from the following methods: first use any type of text box with Edit-->Move Vtx/Seg command After reaching the specification range, make Flash, and then make other text boxes of the same type into the same Flash. However, it should be noted that after making the Flash, you must break it up to prevent the D code from rotating when you open the data.
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