Yangzhou Yangyang Optoelectronics, which was invested by Taiwan LED Epitaxial Factory, was opened on 2010/12/18. The opening ceremony was unprecedented, and thousands of LED operators, government officials and local residents were invited that day. Including the Yangzhou Municipal Party Committee Wang Yan, the Mayor Xie Zhengyi and LGD President Quan Yingshou and many other guests attended the opening ceremony.
Under the competition of local governments in China to actively attract investment from the LED industry, the Yangzhou Municipal Government has taken the lead in providing a MOCVD machine with a financial subsidy of RMB 10 million, which has successfully attracted Taiwan’s Epistar Factory. Officially settled in Yangzhou.
At present, Jiangsu Shengyang Optoelectronics has a paid-in capital of 90 million US dollars. Mainly engaged in the production of blue epitaxial wafers and chips. It is estimated that by the end of 2011, the MOCVD capacity will reach 50 units, and after the production, the LED blue epitaxial wafer production capacity will reach 1.44 million, and the LED chip will reach 18000 KK.
Yangyang Power Plant District Planning
The reporter has the opportunity to visit the planning of the Yangguang Power Plant. At present, the machines that the Shengyang Optoelectronics has moved into include two major brand factories, AIXTRON and VEECO. The two are mainly based on 2-inch machines, and will be moved into 4-inch machines in the future.
The LED epitaxial wafer process firstly grows the sapphire substrate into the epitaxial furnace and grows the LED epitaxial wafer by pouring into compound materials such as TMGA and NH3.
According to the application requirements of different LED components, the LED epitaxial wafer electrode is fabricated through diffusion, metal film evaporation, etching, heat treatment, etc., and then the epitaxial substrate is polished and polished, and then cut and cracked into a single core particle.
The individual chips after cutting will be tested and the photoelectric characteristics of each chip will be tested and classified. Finally, in the visual inspection and reliability experiment
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