At present, the high-power LEDs used in semiconductor lighting have different shapes and advantages, and the opinions of the industry on their morphological development trends are not uniform. Considering the luminous efficiency, application difficulty and cost, the high-power LED mainstream light source for lighting is still a direct white LED, instead of RGB to control the color mixing to produce white light; from the aspects of heat management, luminous efficiency, manufacturing difficulty and reliability, Discrete high-power LEDs below 10W are still the mainstream form of illumination sources. Multi-chip arrays of ultra-high-power LEDs (above 10W) ​​will be mainly used for personalized special lighting fixtures; they will be developed in response to application needs of different lighting product categories. Several new high-power LED mainstream packages are available. Semiconductor light sources have their own characteristics in terms of structure and optical characteristics. Therefore, semiconductor street lamps should be designed according to these characteristics.
To do LED street lights, we must first consider the scope of illumination. Street lights require road lighting effects. The air and roadside airspace is not a task of street lights. Therefore, it is necessary to use a combination of a plurality of angles of the light-emitting tube or a mirror to effectively control the distribution of the light, so that the light emitted from the light-emitting tube becomes a long strip of light spreading along the road surface. It has been proved that the semiconductor thus produced The power of about 90 watts of street lamps can exceed the lighting effect of the 250 watt lamp on the road surface, and the energy saving effect is remarkable.
To do a good job of semiconductor street lamps, we must first choose a suitable light-emitting tube. In general, semiconductor street lamps can be either low-power LEDs or high-power LEDs. However, practice has proved that although the low-power LED has the advantage of low cost of the light-emitting device, its light decay is faster than that of the high-power light-emitting tube, and the number of tubes used is too large, the assembly is troublesome, and comprehensive consideration is made to select a high-power light-emitting tube. More reasonable. From the current technical level of high-power luminous tubes, the luminous efficiency of 1 watt tube is relatively high, and the energy saving advantage for lighting is obvious. Compared with the 1 watt luminous tube, the luminous efficiency of the 3 watt luminous tube is lower than 1 watt tube, and the price advantage under the same luminous flux is not obvious. It is more reasonable to use the 1 watt tube as the street light source.
LED package specificity
LED packaging technology is mostly developed and evolved on the basis of discrete device packaging technology, but it has great speciality. In general, the die of the discrete device is sealed within the package, and the package functions primarily to protect the die and complete the electrical interconnection. The LED package is to complete the output electrical signal, protect the normal operation of the die, output: visible light function, both electrical parameters, optical design and technical requirements, can not simply use the discrete device package for LED.
The core light-emitting portion of the LED is a pn junction die composed of a p-type and an n-type semiconductor. When a minority carrier injected into the pn junction is combined with a majority carrier, visible light, ultraviolet light or near-infrared light is emitted. However, the photons emitted by the pn junction are non-directional, that is, the same probability is emitted in all directions. Therefore, not all the light generated by the die can be released, depending on the quality of the semiconductor material, the structure of the die, and the geometry. The internal structure of the package and the encapsulation material are required to improve the internal and external quantum efficiency of the LED. In a conventional Φ5mm LED package, a square die with a side length of 0.25 mm is bonded or sintered on a lead frame. The positive electrode of the die passes through a spherical contact point and a gold wire, and is bonded to an inner lead connected to a pin, and the negative electrode passes through the reflection. The cup is connected to the other leg of the lead frame and then the top is encapsulated with epoxy. The function of the reflector cup is to collect the light emitted from the side of the die and the interface and emit it in the desired direction.
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