“In Yiwu, Zhejiang Province, we will invest 2 billion yuan to build an industrial park and continue to expand LED production capacity. We will continue to go on the road of LED and go forward!†The theme of “Blue Big Bay Resort Hotel in Shenzhen†was held on April 20, 2016. At the product launch conference of Lighting, Large Backlight, and Great Health, Gong Weibin, Chairman of Ruifeng Optoelectronics , came to the industry association leaders, customers and dozens of industry and mass media.
Ruifeng has been in the packaging industry for 16 years, especially in the field of EMC. As a company that has always been low-key and concentrates on R&D, the focus of this conference is still on products, and it is also the protagonist of this conference - the first FEMC launched in China.
What is FEMC?
The concept of FEMC is taken from the "Filp-chip+EMC" bracket, which is simply a package that uses flip-chip and EMC brackets.
Of course, product technology is not a combination of the two, it is the same as people, not to say that friends are good friends, it is difficult to protect the boat of friendship will not turn over. The more so, the product is not the integration of the two technologies, but the need for long-term research and development breakthroughs.
Ruifeng's FEMC needs to overcome the problems of secondary reflow, cavity rate and leakage dead lights encountered in flip-chip applications. Of course, this is just the tip of the iceberg that has encountered problems during the development process.
Why do you want to do it?
Because the EMC bracket is made of semiconductor-grade etched copper and thermosetting materials, the packaged LED device has the advantages of high power, high luminous efficiency, long life, low thermal resistance, small size, flexible size, and simple application.
The flip chip has the first and lower chip thermal resistance, which can achieve good heat conduction, can lower the junction temperature, thereby improving the efficiency and life and reducing the thermal resistance; at the same junction temperature, increasing the input power, thereby improving the single The output power of the particles. The second, better chip takes light, the current distribution is even, and the injection is better; the back is not blocked, the phosphor coating and the light extraction can be done, and the surface image can be made to further enhance the light extraction. Third, no gold wire (integration, high density) is required. It is easier to form a module; it is densely arranged to output higher power density; it is densely arranged and has an advantage on a high-density display .
In order to fully inherit and promote the advantages of EMC bracket and flip-chip LED chip , Ruifeng Optoelectronics cooperated with international well-known equipment manufacturers and material manufacturers to learn from the traditional semiconductor industry process technology and use 3D technology to successfully implement flip chip on EMC bracket. Packaging, and further build a new pattern of LED devices based on flip-chip technology.
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