Full-featured, cost-optimized, ARM-based solutions designed for broadcast and network HD HEVC set-top boxes will provide future-proof performance and interfaces
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21ic News STMicroelectronics (ST) has introduced the new HD HEVC Liege3 series chipset. For the entry-level set-top box market, the new line of products includes satellite set-top box chipsets (STiH337/STiH332), cable set-top box chipsets (STiH372) and IPTV set-top box chipsets (STiH307/STiH302).
The new series of chipsets is not only an advanced version of the previous generation, but also introduces the latest architecture of Cannes (STiH310/STiH312/318) products and optimized IP to provide customers with future-oriented highly integrated system chips to assist operators. Entry-level set-top boxes are massively upgraded to HEVC (High Efficiency Video Coding).
ST's new set-top box chipset benefits from a scalable hardware and software architecture that allows device vendors to flexibly configure their product platforms to deliver a higher user experience at an affordable price in different HD HEVC entry-level STB markets. The new series of ARM chipsets are all compatible with each other, and different broadcast technologies share the same design, which simplifies development. Compatible with ST's Cannes family of SoCs, the software enables OEMs to easily create innovative client products using a feature-rich development ecosystem that leverages multiple middleware products.
Locking into the satellite TV market, the STiH337/STiH332 SoC will implement a new DVB-S2X demodulation solution that allows multiple system operators (MSOs) to benefit from the higher compression efficiency of HEVC technology. The S2X spectral efficiency is improved and the capacity utilization of the transponder is optimized.
Philippe Notton, vice president and general manager of the Consumer Electronics Group, said: "Our new series of ARM set-top box chipsets strengthen ST's product layout in all high-dynamic HD HEVC entry-level broadcast set-top boxes, and at the same time Our commitment to developing innovative solutions and R&D capabilities. The new Liege3 SoCs enable multi-system operators to leverage a chipset platform that can handle future growth needs, maximizing the lifecycle of HEVC investments. It also supports all of today's latest important interfaces and spectrum utilization optimized broadcast technologies."
From 2.5 K DMIPS GPU-free entry-level products to high-end products with 5K DMIPS built-in GPUs, key features of ST's new series of set-top box SoCs include:
· ARM CPU processing performance of 5K DMIPS, able to run advanced graphical user interface and complex middleware;
· Mali 400 GPU is used in a smooth user interface to support HTML5 on the web platform;
· Performs extensive interoperability testing with all major encoder vendors to verify the performance of HEVC 10-bit;
· Rich and future-oriented interfaces, including Ethernet, USB 3, PCIe, HDMI;
· Integrated DVB-C or DVB-S2X demodulator;
· Support HDR;
· Advanced security engine for secure video content protection based on CAS and DRM;
· 28nm Fully Depleted Silicon On Insulator technology, integrated with high energy efficiency RF module and analog function, can achieve excellent performance under various working conditions, can support very large size Sophisticated fanless design;
The new Liege3 SoCs strengthen ST's commitment to serving the high-definition entry-level set-top box market and are now offering samples to major customers.
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